Wafer Level Optical System

DLP and WLP
DLP [Die Level Package-window filter]

Wafer Level Process
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Square Type | Hexagonal Type |

Die bonding type Package
- MEMS Process를 이용하여 Wafer Level로 제작
- Square, Hexagonal array 및 Dicing 가능
- Die Bonding Package

Coin Type

Housing type Package
- Individual Process 제작 및 Housing type Package에 용이함
- Sputter를 이용하여 기판 측면까지 Metal Coating 가능
- 측면 Metal 증착으로 인하여 Housing Package 진행 시 Sealing에 효과적임
Wafer level Lens
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6 inch |
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8 inch |

Wafer Level Bonding
- MEMS Process를 이용하여 6~8 inch Wafer Level Lens Process
- Square, Hexagonal array 가능
- Wafer Level bonding
Cap Wafer
Regular Cap Wafer [Only Cavity]





Reqular Cap Wafer [Optical coating & Metallization]







- DRIE 및 Bosch Process를 이용한 Si deep cavity Etching.
- Cavity Depth <300um
- Cavity 내부 Optical coating 및 Metallization (Cr,Ni,Ti,Au,Sn,Ge) 가능
- 6~8inch Process
Refractive Lens Cap Wafer
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Front side [Lens] |
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Back side [Cavity] |



Meta surface Cap Wafer
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Meta surface ( |

Single side AR / Meta surface

Double side Meta surface

Wafer level Lens
Introduction

Single side Lens
/Cavity


Wafer level filter
Cavity wafer

Meta surface
[Moth eye]

Double side AR
/Cavity

Single side AR
/Meta surface

Double side
Meta surface
