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Products옵티컬필터

Products

Wafer Level Optical System
3 POSTS
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DLP and WLP

DLP [Die Level Package-window filter]

Wafer Level Process
 
Square Type Hexagonal Type



Die bonding type Package
 
  • MEMS Process를 이용하여 Wafer Level로 제작
  • Square, Hexagonal array 및 Dicing 가능
  • Die Bonding Package


Coin Type


Housing type Package
 
  • Individual Process 제작 및 Housing type Package에 용이함
  • Sputter를 이용하여 기판 측면까지 Metal Coating 가능
  • 측면 Metal 증착으로 인하여 Housing Package 진행 시 Sealing에 효과적임
Wafer level Lens
6 inch
 
8 inch


Wafer Level Bonding
 
  • MEMS Process를 이용하여 6~8 inch Wafer Level Lens Process
  • Square, Hexagonal array 가능
  • Wafer Level bonding
Cap Wafer
Regular Cap Wafer [Only Cavity]

   

   

   

Reqular Cap Wafer [Optical coating & Metallization]

   

   

   


 
  • DRIE 및 Bosch Process를 이용한 Si deep cavity Etching.
  • Cavity Depth <300um
  • Cavity 내부 Optical coating 및 Metallization (Cr,Ni,Ti,Au,Sn,Ge) 가능
  • 6~8inch Process

Refractive Lens Cap Wafer 
  
Front side [Lens]
 
  
Back side [Cavity]

  



Meta surface Cap Wafer
 
Meta surface (


Single side AR / Meta surface


Double side Meta surface
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Wafer level Lens

Introduction
Single side Lens

/Cavity

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Wafer level filter

Cavity wafer


 
Meta surface

[Moth eye]

Double side AR

/Cavity

Single side AR

/Meta surface

Double side

Meta surface

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